DescriptionLead Free Solder WireMG Chemicals Part No.; 4900-35G0.81mm, 96.3% tin, 0.7% copper and 3% silverM.G. Chemicals no clean Lead-Free Solder was designed with Sn/Ag/Cu (Tin/Silver/Copper) alloys as a lead-free alternative for the standard Tin and Lead solder. These alloys conform to the impurity requirements of J-Std-006 and RoHS. Use this solder anywhere you would use normal solder.If your products might enter Europe or California, you must ensure they are RoHS compliant.Products containing lead will not comply. To read more on this issue visit our RoHS Issue AppGuide Features / BenefitsLead freeComplies with RoHSExceeds the impurity requirements of J-Std-006No Clean flux21 Gauge, 0.032″ diametersExcellent wettabilityHard non-conductive residues1 lb of lead free solder has 27% more length than leaded solderFlux PercentageM.G. Chemicals Lead Free Solder utilizes a state-of-the-art automatic wire extrusion and wire drawing machines to manufacture consistent solder. The introduction of flux core in the wire extrusion process involves constant monitoring of flux percentage to ensure minimal flux voids and irregular wire. Typical flux percentage for our Lead Free Solder is 2.0-4.0%.Flux CoreA unique flux system was specifically used for high temperature lead free alloys. It provides the fluxing activity levels that promote fast wetting action and maximum wetting spread. Utilizing synthetically refined resin and very effective activator that wets and spreads like an RA type. This special activator exhibits virtually no spattering. Activator conforms to J-STD-004, REL0.Cleaning Flux core is a no clean formulation therefore the residues do not need to be removed for typical applications.   Test MethodSpecificationAg content2.8-3.2%Cu content0.3-0.7%Sn contentBalanceFlux ClassificationJSTD-004ORL0Copper MirrorIPC-TM-650 2.3.32No removal of copper filmSilver ChromateIPC-TM-650 2.3.33PassCorrosionIPC-TM-650 2.6.15PassSIR JSTD-004,Pattern DownIPC-TM-650 2.6.3.32.33 x 1011 ohmsSIR Bellcore (Telecordia)Bellcore GR-78-CORE 13.1.36.12 x 1011 ohmsElectromigrationBellcore GR-78-CORE 13.1.4PassPost Reflow Flux ResidueTGA Analysis55�id ValueIPC-TM-650 2.3.13190-210Flux Residue DrynessIPC-TM-650 2.4.47PassSpitting of Flux-Cored SolderIPC-TM-650 2.4.480.3%Solder SpreadIPC-TM-650 2.4.46130 mm2Lead free/leaded solder comparisonLead Free Solder (Sn/Ag/Cu)Sn63/Pb37 (Leaded Solder)Melting Point217-221ºC (422.6 – 429.8ºF)183 ºC (361.4 ºF)Upper Temperature LimitDo not to exceed 350 ºC (tip temperature)Do not to exceed 260 ºC (tip temperature)Wire Diameter0.032” (0.81 mm)0.032” (0.81 mm)Std. Wire Gauge2121Tolerance, in. /- 0.002” /- 0.002”Hardness, Brinell15HB14HBCoefficient of Thermal ExpansionPure Sn=23.524.7Tensile Strength4312 psi4442 psiDensity7.39 g/cc8.42 g/ccElectrical Resistivity13.0 μohm-cm14.5 μohm-cmElectrical Conductivity16.6 %IACS11.9 %IACSYield Strength, psi37243950Total Elongation,'48Joint Shear Strength, at 0.1mm/min 20ºC1714Creep Strength, N/mm2 at 0.1mm/min 20ºC13.03.3Creep Strength, N/mm2 at 0.1mm/min 100°C51Thermal Conductivity58.7 W/m * K50.9 W/m * K – See more at: http://www.mgchemicals.com/products/solder/non-leaded/sn96-4900/#sthash.CN1PtFSS.dpuf